Global ball grid array packaging outsourced semiconductor assembly and test services market statistics, 2017-2030 (USD Million)
Global outsourced semiconductor assembly and test services market outlook size was valued at 8,619.7 USD million in 2022 and is estimated to grow at a compound annual growth rate (CAGR) of 8% from 2023 to 2030.
Global ball grid array packaging outsourced semiconductor assembly and test services market statistics, 2017-2030 (USD Million)
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