Market revenue in 2023 | USD 24,057.1 million |
Market revenue in 2030 | USD 41,215.2 million |
Growth rate | 8% (CAGR from 2023 to 2030) |
Largest segment | Assembly & packaging |
Fastest growing segment | Testing |
Historical data covered | 2017 - 2022 |
Base year for estimation | 2023 |
Forecast period covered | 2024 - 2030 |
Quantitative units | Revenue in USD million |
Market segmentation | Assembly & Packaging, Testing |
Key market players worldwide | Powertech Technology Inc, Amkor Technology Inc, ASE Technology Holding Co Ltd ADR, ChipMOS TECHNOLOGIES Inc ADR, Mitsubishi Electric Corp, Aehr Test Systems |
No credit card required*
Name | Profile | # Employees | HQ | Website |
---|
The databook is designed to serve as a comprehensive guide to navigating this sector. The databook focuses on market statistics denoted in the form of revenue and y-o-y growth and CAGR across the globe and regions. A detailed competitive and opportunity analyses related to outsourced semiconductor assembly and test services market will help companies and investors design strategic landscapes.
Assembly & packaging was the largest segment with a revenue share of 81.72% in 2023. Horizon Databook has segmented the Asia Pacific outsourced semiconductor assembly and test services market based on assembly & packaging, testing covering the revenue growth of each sub-segment from 2017 to 2030.
Rapid implementation of robotic processes in Japan, South Korea, India, and China across all industries, mainly in automotive and consumer electronics, has helped the market grow in the region.
China, India, and Taiwan are some of the key regions in Asia Pacific that are witnessing rapid growth of the semiconductor industry.
These countries are expected to continue expanding their presence in the semiconductor industry and further strengthening their share in the global market over the coming years.
Horizon Databook provides a detailed overview of continent-level data and insights on the Asia Pacific outsourced semiconductor assembly and test services market , including forecasts for subscribers. This continent databook contains high-level insights into Asia Pacific outsourced semiconductor assembly and test services market from 2017 to 2030, including revenue numbers, major trends, and company profiles.
Sign up and get instant basic access to databook, upgrade
when ready, or enjoy our
free plan indefinitely.
Included in Horizon account