GVR Report cover Semiconductor Dry Etch Systems Market Size, Share & Trends Report

Semiconductor Dry Etch Systems Market Size, Share & Trends Analysis Report By Etching Technique, By Application (Logic and Memory, Power Devices), By End -use (Consumer Electronics, Automotive), By Region And Segment Forecasts, 2024 - 2030

  • Report ID: GVR-4-68040-463-8
  • Number of Report Pages: 152
  • Format: PDF, Horizon Databook
  • Historical Range: 2018 - 2023
  • Forecast Period: 2024 - 2030 
  • Industry: Advanced Materials

Market Size & Trends

The global semiconductor dry etch systems market size was estimated at USD 15.11 billion in 2023 and is anticipated to grow at a CAGR of 5.8% from 2024 to 2030. The market is experiencing significant growth, driven by the escalating demand for consumer electronics, advancements in IoT, and the burgeoning automotive electronics sector. Manufacturers are focusing on developing innovative etching technologies such as deep reactive-ion etching (DRIE) and plasma etching, to cater to the complex fabrication needs of modern semiconductor devices. For instance, companies such as Applied Materials and Lam Research are leading the charge with their advanced etch systems that offer greater precision and control, enabling the production of smaller, more efficient semiconductor components. This trend towards miniaturization and enhanced performance is crucial for the proliferation of 5G technology and the expansion of cloud computing, further propelling the market forward.

Semiconductor Dry Etch Systems Market Size by Etching Technique, 2020 - 2030 (USD Billion)

The market is driven by growing demand for semiconductors across a variety of applications, including consumer electronics, automotive, and industrial sectors. Dry etching plays a critical role in the semiconductor manufacturing process, allowing for the precise and controlled removal of material from the semiconductor wafer. This is essential for the creation of micro- and nano-scale features on semiconductors, which are integral for the functionality of modern electronic devices.

As devices become more integrated and compact, the requirement for more precise and efficient etching methods grows. Dry etch systems offer several advantages over traditional wet etching, such as higher selectivity, the ability to etch deep structures with vertical sidewalls, and the capacity to process complex patterns. These systems use plasma to remove material, enabling the etching to be more precisely controlled at the microscopic level, which is crucial for the production of advanced semiconductor devices.

Moreover, the transition towards smaller node sizes in semiconductor fabrication, such as the 7nm, 5nm, and even 3nm technology nodes, necessitates the use of advanced dry etching systems that can handle the intricate patterns and structures required at these scales. This miniaturization trend is pushing the boundaries of what's achievable with dry etching technology, driving continuous innovation in the field.

In addition, the development of new materials used in semiconductor devices, such as high-k dielectrics and metal gate materials, requires the development of new etching chemistries and processes. Dry etch systems must be adaptable and versatile to accommodate these materials, further driving the advancement of dry etch technology.

Drivers, Opportunities & Restraints

In the domain of semiconductor fabrication, dry etch systems play a crucial role in shaping and defining the microscopic structures that constitute a semiconductor device. The demand for semiconductor dry etch systems is majorly driven by the relentless pursuit of miniaturization in the electronics industry, the growing complexity of semiconductor device architectures, and the pervasive demand for higher performance and lower power consumption in electronic devices. These factors necessitate the use of advanced etching technologies that can precisely sculpt semiconductor materials at the nanometer scale, fostering innovations in dry etch systems.

However, the sector faces certain restraints, including the high cost of equipment and the complex technical requirements for integrating advanced dry etch systems into existing production lines. The sophisticated nature of these systems demands significant capital investment and a highly skilled workforce to operate and maintain them. In addition, the stringent environmental and safety regulations related to the handling and disposal of the hazardous materials used in etching processes pose challenges to the industry, necessitating continuous advancements in cleaner and safer etching technologies.

Despite these constraints, opportunities abound in the market. The exponential growth in the Internet of Things (IoT), artificial intelligence (AI), and 5G technologies is driving the need for more advanced semiconductors, subsequently fueling the demand for sophisticated dry etch systems capable of manufacturing these components. Moreover, the push towards electric vehicles and renewable energy sources is opening new avenues for specialized semiconductor applications, offering lucrative prospects for the development and deployment of innovative dry etching technologies that can meet these emerging needs.

Etching Technique Insights

“The demand for Deep Reactive Ion Etching (DRIE) etching technique segment is expected to grow at a significant CAGR of 6.1% from 2024 to 2030 in terms of revenue”

The Deep Reactive Ion Etching (DRIE) etching technique segment led the market and accounted for 43.8% of the global revenue share in 2023. Deep Reactive Ion Etching (DRIE) is a highly anisotropic etch process used in microfabrication to create deep, steep-sided holes and trenches in wafers or substrates, often with high aspect ratios. It's a variant of reactive ion etching (RIE) that utilizes cycles of etching and passivation to achieve depths that can be several hundred microns, with precision and uniformity. The demand for DRIE has surged with the advancement of microelectromechanical systems (MEMS), semiconductor manufacturing, and microfluidics, where precise deep etching is critical for the functionality of devices such as accelerometers, microfluidic devices, and intricate 3D structures in silicon.

Reactive Ion Etching (RIE) is a versatile and widely used etching technique in the semiconductor industry that employs chemically reactive plasma to remove targeted material from the surface of substrates. RIE is known for its ability to provide anisotropic etch profiles, which are essential for creating well-defined patterns with high resolution. The demand for RIE technology comes from its critical role in the fabrication of electronic components, including integrated circuits (ICs) and microelectronic devices, where precise pattern transfer and material shaping are fundamental. Its ability to etch a variety of materials with control over the etch rate and profile makes it indispensable in the production of semiconductors and nanotechnology devices.

Application Insights

“The demand for power devices application segment is expected to grow at a significant CAGR of 6.2% from 2024 to 2030 in terms of revenue”

The logic and memory application segment led the market and accounted for 53.2% of the global revenue share in 2023. The semiconductor dry etch systems are indispensable for the production of advanced logic chips, which form the brains of computers, smartphones, and countless other digital devices. The etching process enables the creation of intricate patterns on silicon wafers, defining the microscopic transistors and circuits that process information. As the demand for faster, more efficient computing grows, the precision and capabilities of dry etch technologies continue to advance, allowing for the scaling down of chip features and the enhancement of performance and functionality.

Power devices play a crucial role in managing and converting electrical energy in various applications, from automotive to renewable energy systems. The semiconductor dry etch process is essential in the fabrication of these devices, allowing for the precise shaping and patterning of materials to achieve optimal performance. Through etching techniques, manufacturers can create components that withstand high voltages and currents, significantly improving energy efficiency and reliability in power systems.

End-use Insights

“The demand for telecommunications end use segment is expected to grow at a significant CAGR of 6.1% from 2024 to 2030 in terms of revenue”

The consumer electronics segment led the market and accounted for 45.6% of the global revenue share in 2023. The consumer electronics sector significantly drives the demand for semiconductor dry etch systems, primarily due to the relentless pursuit of more compact, efficient, and powerful devices. As consumers increasingly demand smartphones, laptops, wearables, and other smart devices with enhanced functionalities and performance, manufacturers are pushed to innovate and scale down components without compromising on capability. This miniaturization trend necessitates the use of advanced semiconductor dry etch systems that can precisely shape and create the complex and intricate structures needed for the latest generation of microchips and electronic components. The push for higher density chips, more memory, and faster processing speeds directly translates to a growing need for sophisticated etching systems that can meet these exacting standards with high throughput and efficiency.

Semiconductor Dry Etch Systems Market Share by End-use, 2023 (%)

In the broader electronics industry, the demand for semiconductor dry etch systems is fueled by the expansion of applications beyond traditional consumer electronics, into areas such as automotive, healthcare, and industrial automation. As these sectors increasingly incorporate electronic components and Internet of Things (IoT) connectivity into their products, the requirement for semiconductors that can operate reliably under various conditions intensifies. This diversification of applications broadens the market for semiconductor dry etch systems, as they are critical in manufacturing sensors, controllers, and other semiconductor devices that these new applications demand. The versatility and precision offered by dry etch systems are indispensable for producing the wide range of semiconductor components needed to support the electrification and digitalization of virtually every industry, thereby driving sustained demand in the semiconductor dry etch systems market.

Regional Insights

North America, particularly the United States, continues to be a significant market for semiconductor dry etch systems, driven by its strong research and development ecosystem and the presence of major semiconductor companies. The region's focus on cutting-edge technologies, such as artificial intelligence (AI), 5G, and quantum computing, necessitates the use of advanced semiconductor manufacturing processes, including dry etching. Furthermore, initiatives to bolster domestic semiconductor manufacturing capacity and reduce dependence on foreign supply chains have led to increased investments in semiconductor production facilities, further amplifying the demand for high-precision dry etch systems.

Asia Pacific Semiconductor Dry Etch Systems Market

 “China to witness fastest market growth at 7.5% CAGR”

Asia Pacific semiconductor dry etch systems market held the highest revenue share in 2023. Within the region, excluding China, countries like South Korea, Taiwan, and Japan are significant contributors to the demand for semiconductor dry etch systems. This region is home to some of the world's largest semiconductor manufacturers, who are continually expanding their production capabilities and investing in the latest manufacturing technologies to maintain a competitive edge in the global market. The push towards smaller, more efficient semiconductor devices, along with the expansion of semiconductor applications in automotive and industrial sectors, drives the demand for sophisticated dry etch systems in these countries.

The semiconductor dry etch systems in China are expected to reach at fastest CAGR from 2024 to 2030, The demand for semiconductor dry etch system primarily driven by the country's ambitious plans to boost its domestic semiconductor industry and reduction reliance on foreign technology. With significant investments from both the government and private sector into new fabrication plants and research and development, there is a heightened need for advanced semiconductor manufacturing equipment, including dry etch systems. This demand is further fueled by the growing consumption of consumer electronics within the country, making China a key market for semiconductor equipment suppliers.

Europe Semiconductor Dry Etch Systems Market Trends

In Europe, the demand for semiconductor dry etch systems is growing steadily, supported by the region's focus on automotive, industrial, and power electronics. European semiconductor manufacturers are investing in advanced manufacturing technologies to meet the increasing requirements for power efficiency, miniaturization, and high performance in these applications. The European Union's commitment to digitalization and sustainability also plays a role in driving the semiconductor industry's growth, thereby increasing the need for state-of-the-art dry etch systems to support the production of innovative semiconductor devices.

Key Semiconductor Dry Etch Systems Company Insights

Some key players operating in the market include Nitto Denko Corporation, and Applied Materials Inc., among others.

  • Meyer Industries, Inc. is a premier name in the manufacturing of bulk material handling and food processing equipment. Meyer Industries, known for its innovative solutions, specializes in a wide range of products from vibratory conveyors and bucket elevators to mix-blend systems and more. The company prides itself on delivering high-quality, custom-engineered systems that cater to the specific needs of its clients across various industries, including food processing, pharmaceuticals, and chemicals. Meyer Industries combines state-of-the-art technology with practical design to provide systems that enhance efficiency and productivity for its customers.

  • Syntron Material Handling stands out as a global leader in material handling solutions and manufacturing of conveying and vibratory equipment. The company's rich history and extensive experience have established it as a trusted provider of high-quality feeders, screens, and conveyors. Syntron Material Handling is dedicated to improving the productivity and efficiency of its customers’ operations through innovative designs and technology. The company serves a diverse range of industries, including mining, aggregates, and food processing, offering solutions that are tailored to meet the unique requirements of each sector.

Ted Pella, Inc., and H-Square Corporation are some emerging market participants in the systems market.

  • Ted Pella, Inc. is a family-owned American company specializing in the supply of tools, materials, and equipment for microscopy and related fields. Since its establishment in 1968, the company has grown to be a trusted name among scientists, researchers, and professionals in material science, electronics, and life sciences. Offering a comprehensive range of products, including electron microscopy supplies, precision instruments, and sample preparation tools, Ted Pella, Inc. is dedicated to supporting the scientific community with high-quality solutions that facilitate advanced research and discovery. Their commitment to customer service and technical support underscores their role as a key resource for innovative and reliable scientific tools and materials.

  • H-Square Corporation is a leading provider of semiconductor handling solutions, renowned for designing and manufacturing ergonomic tools and equipment that enhance efficiency and safety in the semiconductor fabrication process. Established in the 1970s, H-Square has built a reputation for excellence by offering a wide range of products, including wafer handling tools, vacuum wands, and custom equipment designed to meet specific customer needs. Their commitment to innovation, quality, and customer satisfaction has made H-Square a preferred partner for semiconductor manufacturers worldwide, helping to streamline operations and protect valuable semiconductor wafers during production and inspection processes. With a focus on addressing the unique challenges of the semiconductor industry, H-Square continues to contribute to the advancement of semiconductor manufacturing technology.

Key Semiconductor Dry Etch Systems Companies:

The following are the leading companies in the semiconductor dry etch systems market. These companies collectively hold the largest market share and dictate industry trends.

  • Shin-Etsu Chemical Co., Ltd.
  • Nitto Denko Corporation
  • H-Square Corporation
  • Ted Pella, Inc.
  • AMAC Technologies
  • SIPEL ELECTRONIC SA
  • Hefei TREC Precision Equipment Co., Ltd.  
  • Applied Materials Inc.
  • Tokyo Electron Limited
  • Lam Research Corporation
  • KLA Corporation

Recent Developments

  • In March 2021, Tokyo Electron (TEL) introduced its newest plasma etch systems, the Impressio 1800 PICP Pro and Betelex 1800 PICP Pro. These systems are equipped with the innovative PICP Pro chamber, designed for high-resolution processing of 6th generation (G6: 1,500 mm x 1,850 mm) glass substrates.

Semiconductor Dry Etch Systems Market Report Scope

Report Attribute

Details

Market size value in 2024

USD 15.96 billion

Revenue forecast in 2030

USD 22.37 billion

Growth rate

CAGR of 5.8% from 2024 to 2030

Actual data

2018 - 2023

Forecast period

2024 - 2030

Quantitative units

Revenue in USD billion and CAGR from 2024 to 2030

Report coverage

Revenue forecast, company market position analysis, competitive landscape, growth factors, and trends

Segments covered

Etching technique, application, end-use, region

Regional scope

North America; Europe; Asia Pacific; Latin America; Middle East & Africa

Country Scope

U.S.; Canada; Mexico; Germany; France; Italy; UK; Spain; China; Japan; India; South Korea; Taiwan; Brazil; Argentina; South Africa; Saudi Arabia; UAE

Key companies profiled

Shin-Etsu Chemical Co., Ltd.; Nitto Denko Corporation; H-Square Corporation; Ted Pella, Inc.; AMAC Technologies; SIPEL ELECTRONIC SA; Hefei TREC Precision Equipment Co., Ltd.; Applied Materials Inc.; Tokyo Electron Limited; Lam Research Corporation; KLA Corporation

Customization scope

Free report customization (equivalent up to 8 analysts working days) with purchase. Addition or alteration to country, regional & segment scope.

Pricing and purchase options

Avail customized purchase options to meet your exact research needs. Explore purchase options

Global Semiconductor Dry Etch Systems Market Report Segmentation

This report forecasts revenue growth at global, regional & country levels and provides an analysis of the industry trends in each of the sub-segments from 2018 to 2030. For this study, Grand View Research has segmented the global semiconductor dry etch systems based on the etching technique, application, end-use, and region:

Global Semiconductor Dry Etch Systems Market Report Segmentation

  • Etching Technique Outlook (Revenue, USD Billion, 2018 - 2030)

    • Reactive Ion Etching (RIE)

    • Inductively Coupled Plasma (ICP) Etching

    • Deep Reactive Ion Etching (DRIE)

  • Application Outlook (Revenue, USD Billion, 2018 - 2030)

    • Logic and Memory

    • MEMS and Sensors

    • Power Devices

  • End-use Outlook (Revenue, USD Billion; 2018 - 2030)

    • Consumer Electronics

    • Automotive

    • Telecommunications

  • Regional Outlook (Revenue, USD Billion, 2018 - 2030)

    • North America

      • U.S.

      • Canada

      • Mexico

    • Europe

      • UK

      • Germany

      • France

      • Italy

      • Spain

    • Asia Pacific

      • Japan

      • China

      • India

      • Taiwan

      • South Korea

    • Latin America

      • Brazil

      • Argentina

    • Middle East & Africa

      • South Africa

      • Saudi Arabia

      • UAE

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