Global Wafer Level Packaging Market Size & Outlook
Global wafer level packaging market, 2018-2030 (US$M)
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Global wafer level packaging market highlights
- The global wafer level packaging market generated a revenue of USD 8,122.5 million in 2024 and is expected to reach USD 14,547.2 million by 2030.
- The market is expected to grow at a CAGR (2025 - 2030) of 10.4% by 2030.
- In terms of segment, 3d tsv wlp accounted for a revenue of USD 4,246.9 million in 2024.
- 3D TSV WLP is the most lucrative type segment registering the fastest growth during the forecast period.
- In terms of region, Asia Pacific was the largest revenue generating market in 2024.
- Country-wise, UK is expected to register the highest CAGR from 2025 to 2030.
Global data book summary
| Market revenue in 2024 | USD 8,122.5 million |
| Market revenue in 2030 | USD 14,547.2 million |
| Growth rate | 10.4% (CAGR from 2025 to 2030) |
| Largest segment | 3d tsv wlp |
| Fastest growing segment | 3D TSV WLP |
| Historical data covered | 2018 - 2023 |
| Base year for estimation | 2024 |
| Forecast period covered | 2025 - 2030 |
| Quantitative units | Revenue in USD million |
| Market segmentation | 3D TSV WLP, 2.5D TSV WLP, Wafer Level Chip Scale Packaging (WLCSP), Nano WLP |
Other key industry trends
- In terms of revenue, the North America accounted for 25.0% of the global wafer level packaging market in 2024.
- By country, the China is projected to lead the global market in terms of revenue in 2030.
- By country, UK is the fastest growing regional market and is projected to reach USD 361.9 million by 2030.
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Wafer Level Packaging Market Scope
Wafer Level Packaging Market Companies
| Name | Profile | # Employees | HQ | Website |
|---|---|---|---|---|
| CAPLINQ | View profile | 11-50 | Assendelft, Noord-Holland, The Netherlands, Europe | https://www.caplinq.com |
| ECI Technology Group | View profile | 101-250 | Toronto, Ontario, Canada, North America | https://ecitech.com |
| Jcet | View profile | 10001+ | Jiangyin, Jiangsu, China, Asia | http://www.cj-elec.com/en/?lang=en&flag=1 |
| Nanotronics Imaging | View profile | 101-250 | New York, New York, United States, North America | http://www.nanotronics.co/ |
| MueTec | View profile | 101-250 | Munich, Bayern, Germany, Europe | http://www.muetec.com/index.php |
| SMTA | View profile | 1-10 | Eden Prairie, Minnesota, United States, North America | https://www.smta.org/ |
| Micross Components | View profile | 501-1000 | Orlando, Florida, United States, North America | http://www.micross.com |
| MKS Instruments Inc | View profile | 10200 | 2 Tech Drive, Suite 201, Andover, MA, United States, 01810 | https://www.mksinst.com |
| Amkor Technology Inc | View profile | 28700 | 2045 East Innovation Circle, Tempe, AZ, United States, 85284 | https://www.amkor.com |
| KLA Corp | View profile | 15210 | One Technology Drive, Milpitas, CA, United States, 95035 | https://www.kla.com |
| ULVAC Inc | View profile | 6264 | 2500 Hagisono, Kanagawa, Chigasaki, Japan, 253-8543 | http://www.ulvac.co.jp |
| Taiwan Semiconductor Manufacturing Co Ltd ADR | View profile | 76478 | No. 8, Li-Hsin Road 6, Hsinchu Science Park, Hsinchu, Taiwan, 300-096 | https://www.tsmc.com |
| Nordson Corp | View profile | 7900 | 28601 Clemens Road, Westlake, OH, United States, 44145 | https://www.nordson.com |
| Bruker Corp | View profile | 9707 | 40 Manning Road, Billerica, MA, United States, 01821 | https://www.bruker.com |
| Asahi Kasei Corp | View profile | 48897 | 1-105 Kanda Jinbocho, Chiyoda-ku, Tokyo, Japan, 101-8101 | http://www.asahi-kasei.co.jp |
Global wafer level packaging market outlook
The databook is designed to serve as a comprehensive guide to navigating this sector. The databook focuses on market statistics denoted in the form of revenue and y-o-y growth and CAGR across the globe and regions. A detailed competitive and opportunity analyses related to wafer level packaging market will help companies and investors design strategic landscapes.
3d tsv wlp was the largest segment with a revenue share of 52.29% in 2024. Horizon Databook has segmented the Global wafer level packaging market based on 3d tsv wlp, 2.5d tsv wlp, wafer level chip scale packaging (wlcsp), nano wlp covering the revenue growth of each sub-segment from 2018 to 2030.
- Global Wafer Level Packaging Type Outlook (Revenue, USD million, 2018-2030)
- 3D TSV WLP
- 2.5D TSV WLP
- Wafer Level Chip Scale Packaging (WLCSP)
- Nano WLP
- Others
- Global Wafer Level Packaging Technology Outlook (Revenue, USD million, 2018-2030)
- Fan-in Wafer Level Packaging (FI-WLP)
- Fan-out Wafer Level Packaging (FO-WLP)
- Global Wafer Level Packaging End Use Outlook (Revenue, USD million, 2018-2030)
- Consumer Electronics
- Automotive
- Healthcare
- IT & Telecommunication
- Others
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Horizon Databook provides a detailed overview of global-level data and insights on the Global wafer level packaging market , including forecasts for subscribers. This global databook contains high-level insights into Global wafer level packaging market from 2018 to 2030, including revenue numbers, major trends, and company profiles.
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Global wafer level packaging market size, by regions, 2018-2030 (US$M)
Top 10 countries: Wafer level packaging market size, 2024 (US$M)
Global wafer level packaging market share, by type, 2024 & 2030 (%, US$M)
Wafer level packaging market: Opportunity assessment by country
Global wafer level packaging market, by region, 2024 (US$M)
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