Global Semiconductor Wafer Polishing And Grinding Equipment Market Size & Outlook
Global semiconductor wafer polishing and grinding equipment market, 2018-2030 (US$M)
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Global semiconductor wafer polishing and grinding equipment market highlights
- The global semiconductor wafer polishing and grinding equipment market generated a revenue of USD 2,806.3 million in 2024 and is expected to reach USD 3,669.3 million by 2030.
- The market is expected to grow at a CAGR (2025 - 2030) of 4.7% by 2030.
- In terms of segment, polishing machine accounted for a revenue of USD 1,884.7 million in 2024.
- Polishing Machine is the most lucrative product segment registering the fastest growth during the forecast period.
- In terms of region, Asia Pacific was the largest revenue generating market in 2024.
- Country-wise, China is expected to register the highest CAGR from 2025 to 2030.
Global data book summary
| Market revenue in 2024 | USD 2,806.3 million |
| Market revenue in 2030 | USD 3,669.3 million |
| Growth rate | 4.7% (CAGR from 2025 to 2030) |
| Largest segment | Polishing machine |
| Fastest growing segment | Polishing Machine |
| Historical data covered | 2018 - 2023 |
| Base year for estimation | 2024 |
| Forecast period covered | 2025 - 2030 |
| Quantitative units | Revenue in USD million |
| Market segmentation | Polishing Machine, Grinding Machine |
Other key industry trends
- In terms of revenue, the North America accounted for 10.4% of the global semiconductor wafer polishing and grinding equipment market in 2024.
- By country, the Taiwan is projected to lead the global market in terms of revenue in 2030.
- By country, China is the fastest growing regional market and is projected to reach USD 612.7 million by 2030.
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Semiconductor Wafer Polishing And Grinding Equipment Market Scope
Semiconductor Wafer Polishing And Grinding Equipment Market Companies
| Name | Profile | # Employees | HQ | Website |
|---|---|---|---|---|
| Qingdao Gaoce Technology | View profile | 1001-5000 | Qingdao, Fujian, China, Asia | http://www.gaoce.cc |
| Shin Nippon Koki | View profile | 501-1000 | Osaka, Osaka, Japan, Asia | https://www.snkc.co.jp/en/ |
| Engis Corporation | View profile | 101-250 | Wheeling, Illinois, United States, North America | http://engis.com |
| Lapmaster Wolters | View profile | 251-500 | Rendsburg, Schleswig-Holstein, Germany, Europe | http://www.peter-wolters.com/ |
| Tokyo Seimitsu | View profile | 1001-5000 | Hachioji, Tokyo, Japan, Asia | https://www.accretech.jp/ |
| Nachi Fujikoshi | View profile | 5001-10000 | Toyama-shi, Toyama, Japan, Asia | http://www.nachi-fujikoshi.co.jp/ |
| Applied Materials Inc | View profile | 34000 | 3050 Bowers Avenue, P.O. Box 58039, Santa Clara, CA, United States, 95052-8039 | https://www.appliedmaterials.com |
| Ebara Corp | View profile | 19629 | 11-1, Haneda Asahi-cho, Ohta-ku, Tokyo, Japan, 144-8510 | http://www.ebara.co.jp |
| Komatsu Ltd | View profile | 70608 | 3-6 Akasaka 2-chome, Minato-ku, Tokyo, Japan, 107-8414 | https://www.komatsu.jp |
Global semiconductor wafer polishing and grinding equipment market outlook
The databook is designed to serve as a comprehensive guide to navigating this sector. The databook focuses on market statistics denoted in the form of revenue and y-o-y growth and CAGR across the globe and regions. A detailed competitive and opportunity analyses related to semiconductor wafer polishing and grinding equipment market will help companies and investors design strategic landscapes.
Polishing machine was the largest segment with a revenue share of 67.16% in 2024. Horizon Databook has segmented the Global semiconductor wafer polishing and grinding equipment market based on polishing machine, grinding machine covering the revenue growth of each sub-segment from 2018 to 2030.
- Global Semiconductor Wafer Polishing And Grinding Equipment Product Outlook (Revenue, USD Million, 2018-2030)
- Grinding Machine
- Polishing Machine
- Single Side Polishing Machine
- Double Side Polishing Machine
- Global Semiconductor Wafer Polishing And Grinding Equipment Wafer Size Outlook (Revenue, USD Million, 2018-2030)
- Less Than 200 mm
- 300 mm
- 200 mm
- Global Semiconductor Wafer Polishing And Grinding Equipment End Use Outlook (Revenue, USD Million, 2018-2030)
- IDMs
- Foundries
- Memory Manufacturers
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Target buyers of Global semiconductor wafer polishing and grinding equipment market databook
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Our clientele includes a mix of semiconductor wafer polishing and grinding equipment market companies, investment firms, advisory firms & academic institutions.
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Approximately 65% of our revenue is generated working with competitive intelligence & market intelligence teams of market participants (manufacturers, service providers, etc.).
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Horizon Databook provides a detailed overview of global-level data and insights on the Global semiconductor wafer polishing and grinding equipment market , including forecasts for subscribers. This global databook contains high-level insights into Global semiconductor wafer polishing and grinding equipment market from 2018 to 2030, including revenue numbers, major trends, and company profiles.
Partial client list
Global semiconductor wafer polishing and grinding equipment market size, by regions, 2018-2030 (US$M)
Top 10 countries: Semiconductor wafer polishing and grinding equipment market size, 2024 (US$M)
Global semiconductor wafer polishing and grinding equipment market share, by product, 2024 & 2030 (%, US$M)
Semiconductor wafer polishing and grinding equipment market: Opportunity assessment by country
Global semiconductor wafer polishing and grinding equipment market, by region, 2024 (US$M)
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