UAE Semiconductor Packaging Market Size & Outlook
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UAE semiconductor packaging market highlights
- The UAE semiconductor packaging market generated a revenue of USD 243.5 million in 2024 and is expected to reach USD 428.2 million by 2030.
- The UAE market is expected to grow at a CAGR of 10% from 2025 to 2030.
- In terms of segment, organic substrate was the largest revenue generating material in 2024.
- Bonding Wire is the most lucrative material segment registering the fastest growth during the forecast period.
Semiconductor packaging market data book summary
| Market revenue in 2024 | USD 243.5 million |
| Market revenue in 2030 | USD 428.2 million |
| Growth rate | 10% (CAGR from 2025 to 2030) |
| Largest segment | Organic substrate |
| Fastest growing segment | Bonding Wire |
| Historical data | 2018 - 2023 |
| Base year | 2024 |
| Forecast period | 2025 - 2030 |
| Quantitative units | Revenue in USD million |
| Market segmentation | Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resins, Ceramic Package, Die Attach Material, Thermal Interface Materials, Solder Balls |
| Key market players worldwide | ASE Group, Amkor Technology Inc, STATS ChipPAC, Siliconware Precision Industries, Powertech Technology Inc, Fujitsu Ltd, ChipMOS TECHNOLOGIES Inc ADR, Intel Corp, Samsung Electronics Co Ltd, Unisem, Interconnect Systems, LG Chem |
Other key industry trends
- In terms of revenue, UAE accounted for 0.6% of the global semiconductor packaging market in 2024.
- Country-wise, China is expected to lead the global market in terms of revenue in 2030.
- In Middle East & Africa, Saudi Arabia semiconductor packaging market is projected to lead the regional market in terms of revenue in 2030.
- UAE is the fastest growing regional market in Middle East & Africa and is projected to reach USD 428.2 million by 2030.
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Semiconductor Packaging Market Scope
Semiconductor Packaging Market Companies
| Name | Profile | # Employees | HQ | Website |
|---|---|---|---|---|
| Interconnect Systems | View profile | 251-500 | Camarillo, California, United States, North America | http://www.isipkg.com |
| Unisem | View profile | 501-1000 | Santa Clara, California, United States, North America | https://www.unisemgroup.com |
| Siliconware Precision Industries | View profile | 10001+ | Taichung, T'ai-wan, Taiwan, Asia | http://www.spil.com.tw |
| STATS ChipPAC | View profile | 10001+ | Singapore, Central Region, Singapore, Asia | http://www.statschippac.com |
| ASE Group | View profile | - | Overland Park, Kansas, United States, North America | http://ase-group.com/ |
| ChipMOS TECHNOLOGIES Inc ADR | View profile | 5396 | No. 1, R&D Road 1, Hsinchu Science Park, Hsinchu, Taiwan | https://www.chipmos.com |
| Powertech Technology Inc | View profile | 8895 | No.10, Datong Road, HuKou, Hsinchu Industrial Park, Hsinchu, Taiwan, 30352 | https://www.pti.com.tw |
| Amkor Technology Inc | View profile | 28700 | 2045 East Innovation Circle, Tempe, AZ, United States, 85284 | https://www.amkor.com |
| LG Chem | View profile | 10001+ | Seoul, Seoul-t'ukpyolsi, South Korea, Asia | https://www.lgchem.com |
| Samsung Electronics Co Ltd | View profile | 124804 | 129, Samsung-ro, Yeongtong-gu, Gyeonggi-do, Suwon-si, Korea, Republic of, 443-742 | https://www.samsung.com |
| Intel Corp | View profile | 124800 | 2200 Mission College Boulevard, Santa Clara, CA, United States, 95054-1549 | https://www.intel.com |
| Fujitsu Ltd | View profile | 124055 | Shiodome City Center, 1-5-2 Higashi-Shimbashi, Minato-ku, Tokyo, Japan, 105-7123 | http://www.fujitsu.com |
UAE semiconductor packaging market outlook
The databook is designed to serve as a comprehensive guide to navigating this sector. The databook focuses on market statistics denoted in the form of revenue and y-o-y growth and CAGR across the globe and regions. A detailed competitive and opportunity analyses related to semiconductor packaging market will help companies and investors design strategic landscapes.
Organic substrate was the largest segment with a revenue share of 47.56% in 2024. Horizon Databook has segmented the UAE semiconductor packaging market based on organic substrate, bonding wire, leadframe, encapsulation resins, ceramic package, die attach material, thermal interface materials, solder balls covering the revenue growth of each sub-segment from 2018 to 2030.
Reasons to subscribe to UAE semiconductor packaging market databook:
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Strategic advantage: By staying updated with the latest market intelligence, companies can stay ahead of competitors, anticipate industry shifts, and capitalize on emerging opportunities.
Target buyers of UAE semiconductor packaging market databook
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Our clientele includes a mix of semiconductor packaging market companies, investment firms, advisory firms & academic institutions.
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30% of our revenue is generated working with investment firms and helping them identify viable opportunity areas.
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Approximately 65% of our revenue is generated working with competitive intelligence & market intelligence teams of market participants (manufacturers, service providers, etc.).
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The rest of the revenue is generated working with academic and research not-for-profit institutes. We do our bit of pro-bono by working with these institutions at subsidized rates.
Horizon Databook provides a detailed overview of country-level data and insights on the UAE semiconductor packaging market , including forecasts for subscribers. This country databook contains high-level insights into UAE semiconductor packaging market from 2018 to 2030, including revenue numbers, major trends, and company profiles.
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UAE semiconductor packaging market size, by material, 2018-2030 (US$M)
UAE Semiconductor Packaging Market Outlook Share, 2024 & 2030 (US$M)
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