Global Semiconductor Packaging Market Size & Outlook
Global semiconductor packaging market, 2018-2030 (US$M)
Related Markets
Global semiconductor packaging market highlights
- The global semiconductor packaging market generated a revenue of USD 39,585.2 million in 2024 and is expected to reach USD 70,896.4 million by 2030.
- The market is expected to grow at a CAGR (2025 - 2030) of 10.4% by 2030.
- In terms of segment, organic substrate accounted for a revenue of USD 18,453.1 million in 2024.
- Bonding Wire is the most lucrative material segment registering the fastest growth during the forecast period.
- In terms of region, Asia Pacific was the largest revenue generating market in 2024.
- Country-wise, Mexico is expected to register the highest CAGR from 2025 to 2030.
Global data book summary
| Market revenue in 2024 | USD 39,585.2 million |
| Market revenue in 2030 | USD 70,896.4 million |
| Growth rate | 10.4% (CAGR from 2025 to 2030) |
| Largest segment | Organic substrate |
| Fastest growing segment | Bonding Wire |
| Historical data covered | 2018 - 2023 |
| Base year for estimation | 2024 |
| Forecast period covered | 2025 - 2030 |
| Quantitative units | Revenue in USD million |
| Market segmentation | Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resins, Ceramic Package, Die Attach Material, Thermal Interface Materials, Solder Balls |
Other key industry trends
- In terms of revenue, the North America accounted for 25.0% of the global semiconductor packaging market in 2024.
- By country, the China is projected to lead the global market in terms of revenue in 2030.
- By country, Mexico is the fastest growing regional market and is projected to reach USD 1,737.1 million by 2030.
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Semiconductor Packaging Market Scope
Semiconductor Packaging Market Companies
| Name | Profile | # Employees | HQ | Website |
|---|---|---|---|---|
| Interconnect Systems | View profile | 251-500 | Camarillo, California, United States, North America | http://www.isipkg.com |
| Unisem | View profile | 501-1000 | Santa Clara, California, United States, North America | https://www.unisemgroup.com |
| Siliconware Precision Industries | View profile | 10001+ | Taichung, T'ai-wan, Taiwan, Asia | http://www.spil.com.tw |
| STATS ChipPAC | View profile | 10001+ | Singapore, Central Region, Singapore, Asia | http://www.statschippac.com |
| ASE Group | View profile | - | Overland Park, Kansas, United States, North America | http://ase-group.com/ |
| ChipMOS TECHNOLOGIES Inc ADR | View profile | 5396 | No. 1, R&D Road 1, Hsinchu Science Park, Hsinchu, Taiwan | https://www.chipmos.com |
| Powertech Technology Inc | View profile | 8895 | No.10, Datong Road, HuKou, Hsinchu Industrial Park, Hsinchu, Taiwan, 30352 | https://www.pti.com.tw |
| Amkor Technology Inc | View profile | 28700 | 2045 East Innovation Circle, Tempe, AZ, United States, 85284 | https://www.amkor.com |
| LG Chem | View profile | 10001+ | Seoul, Seoul-t'ukpyolsi, South Korea, Asia | https://www.lgchem.com |
| Samsung Electronics Co Ltd | View profile | 124804 | 129, Samsung-ro, Yeongtong-gu, Gyeonggi-do, Suwon-si, Korea, Republic of, 443-742 | https://www.samsung.com |
| Intel Corp | View profile | 124800 | 2200 Mission College Boulevard, Santa Clara, CA, United States, 95054-1549 | https://www.intel.com |
| Fujitsu Ltd | View profile | 124055 | Shiodome City Center, 1-5-2 Higashi-Shimbashi, Minato-ku, Tokyo, Japan, 105-7123 | http://www.fujitsu.com |
Global semiconductor packaging market outlook
The databook is designed to serve as a comprehensive guide to navigating this sector. The databook focuses on market statistics denoted in the form of revenue and y-o-y growth and CAGR across the globe and regions. A detailed competitive and opportunity analyses related to semiconductor packaging market will help companies and investors design strategic landscapes.
Organic substrate was the largest segment with a revenue share of 46.62% in 2024. Horizon Databook has segmented the Global semiconductor packaging market based on organic substrate, bonding wire, leadframe, encapsulation resins, ceramic package, die attach material, thermal interface materials, solder balls covering the revenue growth of each sub-segment from 2018 to 2030.
- Global Semiconductor Packaging Material Outlook (Revenue, USD Million, 2018-2030)
- Organic Substrate
- Encapsulation Resins
- Ceramic Package
- Thermal Interface Materials
- Die Attach Material
- Others
- Bonding Wire
- Leadframe
- Solder Balls
- Global Semiconductor Packaging Packaging Technology Outlook (Revenue, USD Million, 2018-2030)
- Advanced Packaging
- 5D/3D
- Fan-out Wafer Level Packaging (FO-WLP)
- Flip Chip
- Embedded Die
- Fan-in Wafer Level Packaging (FI-WLP)
- SIP
- Traditional Packaging
- Advanced Packaging
- Global Semiconductor Packaging End Use Outlook (Revenue, USD Million, 2018-2030)
- Healthcare
- Others
- Consumer Electronics
- IT & Telecommunication
- Aerospace & Defense
- Automotive
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Target buyers of Global semiconductor packaging market databook
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Our clientele includes a mix of semiconductor packaging market companies, investment firms, advisory firms & academic institutions.
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Approximately 65% of our revenue is generated working with competitive intelligence & market intelligence teams of market participants (manufacturers, service providers, etc.).
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Horizon Databook provides a detailed overview of global-level data and insights on the Global semiconductor packaging market , including forecasts for subscribers. This global databook contains high-level insights into Global semiconductor packaging market from 2018 to 2030, including revenue numbers, major trends, and company profiles.
Partial client list
Global semiconductor packaging market size, by regions, 2018-2030 (US$M)
Top 10 countries: Semiconductor packaging market size, 2024 (US$M)
Global semiconductor packaging market share, by material, 2024 & 2030 (%, US$M)
Semiconductor packaging market: Opportunity assessment by country
Global semiconductor packaging market, by region, 2024 (US$M)
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