Middle East & Africa Semiconductor Packaging Market Size & Outlook
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MEA semiconductor packaging market highlights
- The MEA semiconductor packaging market generated a revenue of USD 823.5 million in 2024.
- The market is expected to grow at a CAGR of 9.7% from 2025 to 2030.
- In terms of segment, organic substrate was the largest revenue generating material in 2024.
- Bonding Wire is the most lucrative material segment registering the fastest growth during the forecast period.
- Country-wise, UAE is expected to register the highest CAGR from 2025 to 2030.
MEA data book summary
| Market revenue in 2024 | USD 823.5 million |
| Market revenue in 2030 | USD 1,425.0 million |
| Growth rate | 9.7% (CAGR from 2025 to 2030) |
| Largest segment | Organic substrate |
| Fastest growing segment | Bonding Wire |
| Historical data covered | 2018 - 2023 |
| Base year for estimation | 2024 |
| Forecast period covered | 2025 - 2030 |
| Quantitative units | Revenue in USD million |
| Market segmentation | Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resins, Ceramic Package, Die Attach Material, Thermal Interface Materials, Solder Balls |
| Key market players worldwide | ASE Group, Amkor Technology Inc, STATS ChipPAC, Siliconware Precision Industries, Powertech Technology Inc, Fujitsu Ltd, ChipMOS TECHNOLOGIES Inc ADR, Intel Corp, Samsung Electronics Co Ltd, Unisem, Interconnect Systems, LG Chem |
Other key industry trends
- In terms of revenue, MEA region accounted for 2.1% of the global semiconductor packaging market in 2024.
- Globally, Asia Pacific is projected to lead the regional market in terms of revenue in 2030.
- Asia Pacific is the fastest growing regional market and is projected to reach USD 38,035.9 million by 2030.
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Semiconductor Packaging Market Scope
Semiconductor Packaging Market Companies
| Name | Profile | # Employees | HQ | Website |
|---|---|---|---|---|
| Interconnect Systems | View profile | 251-500 | Camarillo, California, United States, North America | http://www.isipkg.com |
| Unisem | View profile | 501-1000 | Santa Clara, California, United States, North America | https://www.unisemgroup.com |
| Siliconware Precision Industries | View profile | 10001+ | Taichung, T'ai-wan, Taiwan, Asia | http://www.spil.com.tw |
| STATS ChipPAC | View profile | 10001+ | Singapore, Central Region, Singapore, Asia | http://www.statschippac.com |
| ASE Group | View profile | - | Overland Park, Kansas, United States, North America | http://ase-group.com/ |
| ChipMOS TECHNOLOGIES Inc ADR | View profile | 5396 | No. 1, R&D Road 1, Hsinchu Science Park, Hsinchu, Taiwan | https://www.chipmos.com |
| Powertech Technology Inc | View profile | 8895 | No.10, Datong Road, HuKou, Hsinchu Industrial Park, Hsinchu, Taiwan, 30352 | https://www.pti.com.tw |
| Amkor Technology Inc | View profile | 28700 | 2045 East Innovation Circle, Tempe, AZ, United States, 85284 | https://www.amkor.com |
| LG Chem | View profile | 10001+ | Seoul, Seoul-t'ukpyolsi, South Korea, Asia | https://www.lgchem.com |
| Samsung Electronics Co Ltd | View profile | 124804 | 129, Samsung-ro, Yeongtong-gu, Gyeonggi-do, Suwon-si, Korea, Republic of, 443-742 | https://www.samsung.com |
| Intel Corp | View profile | 124800 | 2200 Mission College Boulevard, Santa Clara, CA, United States, 95054-1549 | https://www.intel.com |
| Fujitsu Ltd | View profile | 124055 | Shiodome City Center, 1-5-2 Higashi-Shimbashi, Minato-ku, Tokyo, Japan, 105-7123 | http://www.fujitsu.com |
Middle East & Africa semiconductor packaging market outlook
The databook is designed to serve as a comprehensive guide to navigating this sector. The databook focuses on market statistics denoted in the form of revenue and y-o-y growth and CAGR across the globe and regions. A detailed competitive and opportunity analyses related to semiconductor packaging market will help companies and investors design strategic landscapes.
Organic substrate was the largest segment with a revenue share of 47.29% in 2024. Horizon Databook has segmented the Middle East & Africa semiconductor packaging market based on organic substrate, bonding wire, leadframe, encapsulation resins, ceramic package, die attach material, thermal interface materials, solder balls covering the revenue growth of each sub-segment from 2018 to 2030.
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Target buyers of Middle East & Africa semiconductor packaging market databook
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Our clientele includes a mix of semiconductor packaging market companies, investment firms, advisory firms & academic institutions.
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30% of our revenue is generated working with investment firms and helping them identify viable opportunity areas.
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Approximately 65% of our revenue is generated working with competitive intelligence & market intelligence teams of market participants (manufacturers, service providers, etc.).
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Horizon Databook provides a detailed overview of continent-level data and insights on the Middle East & Africa semiconductor packaging market , including forecasts for subscribers. This continent databook contains high-level insights into Middle East & Africa semiconductor packaging market from 2018 to 2030, including revenue numbers, major trends, and company profiles.
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MEA semiconductor packaging market size, by country, 2018-2030 (US$M)
Middle East & Africa Semiconductor Packaging Market Outlook Share, 2024 & 2030 (US$M)
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