Market revenue in 2023 | USD 1,428.8 million |
Market revenue in 2030 | USD 2,676.5 million |
Growth rate | 9.4% (CAGR from 2023 to 2030) |
Largest segment | Organic substrate |
Fastest growing segment | Organic Substrate |
Historical data covered | 2018 - 2022 |
Base year for estimation | 2023 |
Forecast period covered | 2024 - 2030 |
Quantitative units | Revenue in USD million |
Market segmentation | Organic Substrate |
Key market players worldwide | ASE Group, Amkor Technology Inc, STATS ChipPAC, Siliconware Precision Industries, Powertech Technology Inc, Fujitsu Ltd, ChipMOS TECHNOLOGIES Inc ADR, Intel Corp, Samsung Electronics Co Ltd, Unisem, Interconnect Systems, LG Chem |
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The databook is designed to serve as a comprehensive guide to navigating this sector. The databook focuses on market statistics denoted in the form of revenue and y-o-y growth and CAGR across the globe and regions. A detailed competitive and opportunity analyses related to semiconductor packaging market will help companies and investors design strategic landscapes.
Organic substrate was the largest segment with a revenue share of 100% in 2023. Horizon Databook has segmented the Latin America semiconductor packaging market based on organic substrate covering the revenue growth of each sub-segment from 2018 to 2030.
Horizon Databook provides a detailed overview of continent-level data and insights on the Latin America semiconductor packaging market , including forecasts for subscribers. This continent databook contains high-level insights into Latin America semiconductor packaging market from 2018 to 2030, including revenue numbers, major trends, and company profiles.
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