Global Lcp Based Molded Interconnect Devices Market Size & Outlook

The global lcp based molded interconnect devices market size was estimated at USD 737.5 million in 2024 and is projected to reach USD 1,897.2 million by 2030, growing at a CAGR of 17.5% from 2025 to 2030.
Revenue, 2024 (US$M)
$737.5
Forecast, 2030 (US$M)
$1,897.2
CAGR, 2025 - 2030
17.5%
Report Coverage
Worldwide

Global lcp based molded interconnect devices market, 2018-2030 (US$M)

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Global lcp based molded interconnect devices market highlights

  • The global lcp based molded interconnect devices market generated a revenue of USD 737.5 million in 2024 and is expected to reach USD 1,897.2 million by 2030.
  • The market is expected to grow at a CAGR (2025 - 2030) of 17.5% by 2030.
  • In terms of segment, laser direct structuring (lds) accounted for a revenue of USD 466.9 million in 2024.
  • Laser Direct Structuring (LDS) is the most lucrative process segment registering the fastest growth during the forecast period.
  • In terms of region, Asia Pacific was the largest revenue generating market in 2024.
  • Country-wise, India is expected to register the highest CAGR from 2025 to 2030.

Global data book summary

Market revenue in 2024USD 737.5 million
Market revenue in 2030USD 1,897.2 million
Growth rate17.5% (CAGR from 2025 to 2030)
Largest segmentLaser direct structuring (lds)
Fastest growing segmentLaser Direct Structuring (LDS)
Historical data covered2018 - 2023
Base year for estimation2024
Forecast period covered2025 - 2030
Quantitative unitsRevenue in USD million
Market segmentationLaser Direct Structuring (LDS), Two-Shot Molding, Others Process

Other key industry trends

  • In terms of revenue, the North America accounted for 28.9% of the global lcp based molded interconnect devices market in 2024.
  • By country, the U.S. is projected to lead the global market in terms of revenue in 2030.
  • By country, India is the fastest growing regional market and is projected to reach USD 159.2 million by 2030.

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LCP Based Molded Interconnect Devices Market Companies

Name Profile # Employees HQ Website
Harting Technology Group View profile 11-50 Barcelona, Catalonia, Spain, Europe http://www.harting.es
Sumitomo Electric Industries Ltd View profile 334716 4-5-33, Kitahama, Chuo-ku, Osaka, Japan, 541-0041 http://www.sei.co.jp
Molex View profile 11-50 Hankamer, Texas, United States, North America https://www.molexcompany.com
Kyocera Corp View profile 81209 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto, Japan, 612-8501 http://www.kyocera.co.jp
TE Connectivity Ltd View profile 90000 Muhlenstrasse 26, Schaffhausen, Switzerland, CH-8200 https://www.te.com
Amphenol Corp Class A View profile 95000 358 Hall Avenue, Wallingford, CT, United States, 06492 https://www.amphenol.com

Global lcp based molded interconnect devices market outlook

The databook is designed to serve as a comprehensive guide to navigating this sector. The databook focuses on market statistics denoted in the form of revenue and y-o-y growth and CAGR across the globe and regions. A detailed competitive and opportunity analyses related to lcp based molded interconnect devices market will help companies and investors design strategic landscapes.


Laser direct structuring (lds) was the largest segment with a revenue share of 63.31% in 2024. Horizon Databook has segmented the Global lcp based molded interconnect devices market based on laser direct structuring (lds), two-shot molding, others process covering the revenue growth of each sub-segment from 2018 to 2030.


  • Global LCP Based Molded Interconnect Devices Process Outlook (Revenue, USD Million, 2018-2030)
    • Laser Direct Structuring (LDS)
    • Two-Shot Molding
    • Others Process
  • Global LCP Based Molded Interconnect Devices Product Outlook (Revenue, USD Million, 2018-2030)
    • Sensor Housings
    • Antennas
    • Connectors & Interconnects
    • Others Product
  • Global LCP Based Molded Interconnect Devices End Use Outlook (Revenue, USD Million, 2018-2030)
    • Healthcare
    • Automotive
    • Consumer Electronics
    • Telecommunication
    • Aerospace and Defense
    • Others End Use

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Horizon Databook provides a detailed overview of global-level data and insights on the Global lcp based molded interconnect devices market , including forecasts for subscribers. This global databook contains high-level insights into Global lcp based molded interconnect devices market from 2018 to 2030, including revenue numbers, major trends, and company profiles.

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Global lcp based molded interconnect devices market size, by regions, 2018-2030 (US$M)

Top 10 countries: Lcp based molded interconnect devices market size, 2024 (US$M)

Global lcp based molded interconnect devices market share, by process, 2024 & 2030 (%, US$M)

Lcp based molded interconnect devices market: Opportunity assessment by country

Global lcp based molded interconnect devices market, by region, 2024 (US$M)

Global lcp based molded interconnect devices market size, by regions, 2018-2030 (US$M)

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