Global Molded Interconnect Device Market Size & Outlook
The global molded interconnect device market size was estimated at USD 1,911.7 million in 2023 and is projected to reach USD 4,560.7 million by 2030, growing at a CAGR of 13.2% from 2024 to 2030.
Revenue, 2023 (US$M)
$1,911.7
Forecast, 2030 (US$M)
$4,560.7
CAGR, 2024 - 2030
13.2%
Report Coverage
Worldwide
Global molded interconnect device market, 2018-2030 (US$M)
Global molded interconnect device market highlights
- The global molded interconnect device market generated a revenue of USD 1,911.7 million in 2023 and is expected to reach USD 4,560.7 million by 2030.
- The market is expected to grow at a CAGR (2024 - 2030) of 13.2% by 2030.
- In terms of segment, laser direct structuring (lds) accounted for a revenue of USD 1,911.7 million in 2023.
- Laser Direct Structuring (LDS) is the most lucrative process segment registering the fastest growth during the forecast period.
- In terms of region, Asia Pacific was the largest revenue generating market in 2023.
Global data book summary
| Market revenue in 2023 | USD 1,911.7 million |
| Market revenue in 2030 | USD 4,560.7 million |
| Growth rate | 13.2% (CAGR from 2024 to 2030) |
| Largest segment | Laser direct structuring (lds) |
| Fastest growing segment | Laser Direct Structuring (LDS) |
| Historical data covered | 2018 - 2022 |
| Base year for estimation | 2023 |
| Forecast period covered | 2024 - 2030 |
| Quantitative units | Revenue in USD million |
| Market segmentation | Laser Direct Structuring (LDS) |
Other key industry trends
- In terms of revenue, the North America accounted for 29.1% of the global molded interconnect device market in 2023.
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Molded Interconnect Device Market Scope
Molded interconnect device market segmentation & scope
Product
Sensor Housings
Antennas
Connectors & Switchers
Lighting
Other Product
End Use
Healthcare
Automotive
Consumer Electronics
Telecommunication
Aerospace and Defense
Other End Use
Countries
U.S.
Canada
Mexico
UK
Germany
France
China
Japan
India
South Korea
Australia
Brazil
Saudi Arabia
UAE
South Africa
Molded Interconnect Device Market Companies
| Name | Profile | # Employees | HQ | Website |
|---|---|---|---|---|
| Koch Industries | View profile | 10001+ | Wichita, Kansas, United States, North America | https://www.kochind.com |
| Kyocera Corp | View profile | 81209 | 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto, Japan, 612-8501 | http://www.kyocera.co.jp |
| TE Connectivity Ltd | View profile | 90000 | Muhlenstrasse 26, Schaffhausen, Switzerland, CH-8200 | https://www.te.com |
| Amphenol Corp Class A | View profile | 95000 | 358 Hall Avenue, Wallingford, CT, United States, 06492 | https://www.amphenol.com |
| Sumitomo Corp | View profile | 108457 | 3-2 Otemachi 2-Chome, Chiyoda-ku, Tokyo, Japan, 100-8601 | http://www.sumitomocorp.co.jp |
Global molded interconnect device market size, by regions, 2018-2030 (US$M)
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