Global Molded Interconnect Device Market Size & Outlook
The global molded interconnect device market size was estimated at USD 1,911.7 million in 2023 and is projected to reach USD 4,560.7 million by 2030, growing at a CAGR of 13.2% from 2024 to 2030.
Revenue, 2023 (US$M)
$1,911.7
Forecast, 2030 (US$M)
$4,560.7
CAGR, 2024 - 2030
13.2%
Report Coverage
Worldwide
Global molded interconnect device market, 2018-2030 (US$M)
Global molded interconnect device market highlights
- The global molded interconnect device market generated a revenue of USD 1,911.7 million in 2023 and is expected to reach USD 4,560.7 million by 2030.
- The market is expected to grow at a CAGR (2024 - 2030) of 13.2% by 2030.
- In terms of segment, laser direct structuring (lds) accounted for a revenue of USD 1,911.7 million in 2023.
- Laser Direct Structuring (LDS) is the most lucrative process segment registering the fastest growth during the forecast period.
- In terms of region, Asia Pacific was the largest revenue generating market in 2023.
Global data book summary
| Market revenue in 2023 | USD 1,911.7 million |
| Market revenue in 2030 | USD 4,560.7 million |
| Growth rate | 13.2% (CAGR from 2024 to 2030) |
| Largest segment | Laser direct structuring (lds) |
| Fastest growing segment | Laser Direct Structuring (LDS) |
| Historical data covered | 2018 - 2022 |
| Base year for estimation | 2023 |
| Forecast period covered | 2024 - 2030 |
| Quantitative units | Revenue in USD million |
| Market segmentation | Laser Direct Structuring (LDS) |
Other key industry trends
- In terms of revenue, the North America accounted for 29.1% of the global molded interconnect device market in 2023.
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Molded Interconnect Device Market Companies
| Name | Profile | # Employees | HQ | Website |
|---|---|---|---|---|
| Koch Industries | View profile | 10001+ | Wichita, Kansas, United States, North America | https://www.kochind.com |
| Kyocera Corp | View profile | 81209 | 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto, Japan, 612-8501 | http://www.kyocera.co.jp |
| TE Connectivity Ltd | View profile | 90000 | Muhlenstrasse 26, Schaffhausen, Switzerland, CH-8200 | https://www.te.com |
| Amphenol Corp Class A | View profile | 95000 | 358 Hall Avenue, Wallingford, CT, United States, 06492 | https://www.amphenol.com |
| Sumitomo Corp | View profile | 108457 | 3-2 Otemachi 2-Chome, Chiyoda-ku, Tokyo, Japan, 100-8601 | http://www.sumitomocorp.co.jp |
Global molded interconnect device market size, by regions, 2018-2030 (US$M)
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