India Wafer Level Packaging Market Size & Outlook
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India wafer level packaging market highlights
- The India wafer level packaging market generated a revenue of USD 1,016.1 million in 2024 and is expected to reach USD 1,854.8 million by 2030.
- The India market is expected to grow at a CAGR of 10.7% from 2025 to 2030.
- In terms of segment, 3d tsv wlp was the largest revenue generating type in 2024.
- 3D TSV WLP is the most lucrative type segment registering the fastest growth during the forecast period.
Wafer level packaging market data book summary
| Market revenue in 2024 | USD 1,016.1 million |
| Market revenue in 2030 | USD 1,854.8 million |
| Growth rate | 10.7% (CAGR from 2025 to 2030) |
| Largest segment | 3d tsv wlp |
| Fastest growing segment | 3D TSV WLP |
| Historical data | 2018 - 2023 |
| Base year | 2024 |
| Forecast period | 2025 - 2030 |
| Quantitative units | Revenue in USD million |
| Market segmentation | 3D TSV WLP, 2.5D TSV WLP, Wafer Level Chip Scale Packaging (WLCSP), Nano WLP |
| Key market players worldwide | Amkor Technology Inc, Taiwan Semiconductor Manufacturing Co Ltd ADR, MKS Instruments Inc, ULVAC Inc, Micross Components, KLA Corp, Bruker Corp, Nordson Corp, Asahi Kasei Corp |
Other key industry trends
- In terms of revenue, India accounted for 12.5% of the global wafer level packaging market in 2024.
- Country-wise, China is expected to lead the global market in terms of revenue in 2030.
- In Asia Pacific, China wafer level packaging market is projected to lead the regional market in terms of revenue in 2030.
- China is the fastest growing regional market in Asia Pacific and is projected to reach USD 2,866.4 million by 2030.
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Wafer Level Packaging Market Scope
Wafer Level Packaging Market Companies
| Name | Profile | # Employees | HQ | Website |
|---|---|---|---|---|
| CAPLINQ | View profile | 11-50 | Assendelft, Noord-Holland, The Netherlands, Europe | https://www.caplinq.com |
| ECI Technology Group | View profile | 101-250 | Toronto, Ontario, Canada, North America | https://ecitech.com |
| Jcet | View profile | 10001+ | Jiangyin, Jiangsu, China, Asia | http://www.cj-elec.com/en/?lang=en&flag=1 |
| Nanotronics Imaging | View profile | 101-250 | New York, New York, United States, North America | http://www.nanotronics.co/ |
| MueTec | View profile | 101-250 | Munich, Bayern, Germany, Europe | http://www.muetec.com/index.php |
| SMTA | View profile | 1-10 | Eden Prairie, Minnesota, United States, North America | https://www.smta.org/ |
| Micross Components | View profile | 501-1000 | Orlando, Florida, United States, North America | http://www.micross.com |
| MKS Instruments Inc | View profile | 10200 | 2 Tech Drive, Suite 201, Andover, MA, United States, 01810 | https://www.mksinst.com |
| Amkor Technology Inc | View profile | 28700 | 2045 East Innovation Circle, Tempe, AZ, United States, 85284 | https://www.amkor.com |
| KLA Corp | View profile | 15210 | One Technology Drive, Milpitas, CA, United States, 95035 | https://www.kla.com |
| ULVAC Inc | View profile | 6264 | 2500 Hagisono, Kanagawa, Chigasaki, Japan, 253-8543 | http://www.ulvac.co.jp |
| Taiwan Semiconductor Manufacturing Co Ltd ADR | View profile | 76478 | No. 8, Li-Hsin Road 6, Hsinchu Science Park, Hsinchu, Taiwan, 300-096 | https://www.tsmc.com |
| Nordson Corp | View profile | 7900 | 28601 Clemens Road, Westlake, OH, United States, 44145 | https://www.nordson.com |
| Bruker Corp | View profile | 9707 | 40 Manning Road, Billerica, MA, United States, 01821 | https://www.bruker.com |
| Asahi Kasei Corp | View profile | 48897 | 1-105 Kanda Jinbocho, Chiyoda-ku, Tokyo, Japan, 101-8101 | http://www.asahi-kasei.co.jp |
India wafer level packaging market outlook
The databook is designed to serve as a comprehensive guide to navigating this sector. The databook focuses on market statistics denoted in the form of revenue and y-o-y growth and CAGR across the globe and regions. A detailed competitive and opportunity analyses related to wafer level packaging market will help companies and investors design strategic landscapes.
3d tsv wlp was the largest segment with a revenue share of 52.21% in 2024. Horizon Databook has segmented the India wafer level packaging market based on 3d tsv wlp, 2.5d tsv wlp, wafer level chip scale packaging (wlcsp), nano wlp covering the revenue growth of each sub-segment from 2018 to 2030.
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Our clientele includes a mix of wafer level packaging market companies, investment firms, advisory firms & academic institutions.
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Horizon Databook provides a detailed overview of country-level data and insights on the India wafer level packaging market , including forecasts for subscribers. This country databook contains high-level insights into India wafer level packaging market from 2018 to 2030, including revenue numbers, major trends, and company profiles.
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India wafer level packaging market size, by type, 2018-2030 (US$M)
India Wafer Level Packaging Market Outlook Share, 2024 & 2030 (US$M)
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