North America Semiconductor Bonding Market Size & Outlook
The semiconductor bonding market in North America is expected to reach a projected revenue of US$ 112.9 million by 2030. A compound annual growth rate of 2.1% is expected of North America semiconductor bonding market from 2024 to 2030.
Revenue, 2023 (US$M)
$97.9
Forecast, 2030 (US$M)
$112.9
CAGR, 2024 - 2030
2.1%
Report Coverage
North America
North America semiconductor bonding market, 2018-2030 (US$M)
North America semiconductor bonding market highlights
- The North America semiconductor bonding market generated a revenue of USD 97.9 million in 2023.
- The market is expected to grow at a CAGR of 2.1% from 2024 to 2030.
- In terms of segment, rf devices was the largest revenue generating application in 2023.
- RF Devices is the most lucrative application segment registering the fastest growth during the forecast period.
North America data book summary
| Market revenue in 2023 | USD 97.9 million |
| Market revenue in 2030 | USD 112.9 million |
| Growth rate | 2.1% (CAGR from 2023 to 2030) |
| Largest segment | Rf devices |
| Fastest growing segment | RF Devices |
| Historical data covered | 2018 - 2022 |
| Base year for estimation | 2023 |
| Forecast period covered | 2024 - 2030 |
| Quantitative units | Revenue in USD million |
| Market segmentation | RF Devices |
| Key market players worldwide | EV Group, ASMPT Ltd, MRSI Systems, Panasonic Holdings Corp, Palomar Holdings Inc, Tresky, BE Semiconductor Industries NV, Kulicke & Soffa Industries Inc, Tokyo Electron Ltd |
Other key industry trends
- In terms of revenue, North America region accounted for 10.6% of the global semiconductor bonding market in 2023.
- Globally, Asia Pacific is projected to lead the regional market in terms of revenue in 2030.
- Asia Pacific is the fastest growing regional market and is projected to reach USD 842.7 million by 2030.
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Semiconductor Bonding Market Scope
Semiconductor bonding market segmentation & scope
Type
Die Bonder
Wafer Bonder
Flip Chip Bonder
Process Type
Die to Die Bonding
Die to Wafer Bonding
Wafer to Wafer Bonding
Countries
U.S.
Mexico
Canada
France
Germany
Italy
Spain
UK
Taiwan
South Korea
China
India
Japan
Brazil
Argentina
Saudi Arabia
South Africa
UAE
Semiconductor Bonding Market Companies
| Name | Profile | # Employees | HQ | Website |
|---|
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