Middle East & Africa Semiconductor Bonding Market Size & Outlook

The semiconductor bonding market in Middle East & Africa is expected to reach a projected revenue of US$ 16.8 million by 2030. A compound annual growth rate of 1.8% is expected of Middle East & Africa semiconductor bonding market from 2024 to 2030.
Revenue, 2023 (US$M)
$14.8
Forecast, 2030 (US$M)
$16.8
CAGR, 2024 - 2030
1.8%
Report Coverage
Middle East & Africa

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Middle East & Africa semiconductor bonding market, 2018-2030 (US$M)

Middle East & Africa semiconductor bonding market, 2018-2030 (US$M)

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MEA semiconductor bonding market highlights

  • The MEA semiconductor bonding market generated a revenue of USD 14.8 million in 2023.
  • The market is expected to grow at a CAGR of 1.8% from 2024 to 2030.
  • In terms of segment, rf devices was the largest revenue generating application in 2023.
  • RF Devices is the most lucrative application segment registering the fastest growth during the forecast period.

MEA data book summary

Market revenue in 2023USD 14.8 million
Market revenue in 2030USD 16.8 million
Growth rate1.8% (CAGR from 2024 to 2030)
Largest segmentRf devices
Fastest growing segmentRF Devices
Historical data covered2018 - 2022
Base year for estimation2023
Forecast period covered2024 - 2030
Quantitative unitsRevenue in USD million
Market segmentationRF Devices
Key market players worldwideEV Group, ASMPT Ltd, MRSI Systems, Panasonic Holdings Corp, Palomar Holdings Inc, Tresky, BE Semiconductor Industries NV, Kulicke & Soffa Industries Inc, Tokyo Electron Ltd

Other key industry trends

  • In terms of revenue, MEA region accounted for 1.6% of the global semiconductor bonding market in 2023.
  • Globally, Asia Pacific is projected to lead the regional market in terms of revenue in 2030.
  • Asia Pacific is the fastest growing regional market and is projected to reach USD 842.7 million by 2030.

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Semiconductor Bonding Market Scope

Semiconductor bonding market segmentation & scope
RF Devices
MEMS & Sensors
CMOS Image & Sensors
LED
3D NAND
Type
Die Bonder
Wafer Bonder
Flip Chip Bonder
Process Type
Die to Die Bonding
Die to Wafer Bonding
Wafer to Wafer Bonding
Countries
U.S.
Mexico
Canada
France
Germany
Italy
Spain
UK
Taiwan
South Korea
China
India
Japan
Brazil
Argentina
Saudi Arabia
South Africa
UAE

Semiconductor Bonding Market Companies

Name Profile # Employees HQ Website
Kulicke & Soffa Industries Inc View profile 3025 1005 Virginia Drive, Fort Washington, Philadelphia, PA, United States, 19034 https://www.kns.com
BE Semiconductor Industries NV View profile 1870 Ratio 6, Duiven, Netherlands, 6921 RW https://www.besi.com
Tresky View profile 11-50 Thalwil, Zurich, Switzerland, Europe https://www.tresky.com
MRSI Systems View profile 51-100 North Billerica, Massachusetts, United States, North America https://mrsisystems.com/
ASMPT Ltd View profile 10800 2 Yishun Avenue 7, Singapore, Singapore, 768924 https://www.asmpt.com
EV Group View profile 501-1000 Sankt Florian Am Inn, Oberosterreich, Austria, Europe http://www.evgroup.com/en
Palomar Holdings Inc View profile 213 7979 Ivanhoe Avenue, Suite 500, La Jolla, CA, United States, 92037 https://plmr.com
Tokyo Electron Ltd View profile 17204 Akasaka Biz Tower, 3-1 Akasaka 5-chome, Minato-ku, Tokyo, Japan, 107-6325 http://www.tel.co.jp
Panasonic Holdings Corp View profile 230025 1006, Oaza Kadoma, Kadoma-shi, Osaka, Japan, 571-8501 https://holdings.panasonic

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