Europe Semiconductor Assembly And Packaging Equipment Market Size & Outlook
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Europe semiconductor assembly and packaging equipment market highlights
- The Europe semiconductor assembly and packaging equipment market generated a revenue of USD 859.1 million in 2024.
- The market is expected to grow at a CAGR of 7.9% from 2025 to 2033.
- In terms of segment, dicing equipment was the largest revenue generating product in 2024.
- Dicing Equipment is the most lucrative product segment registering the fastest growth during the forecast period.
Europe data book summary
| Market revenue in 2024 | USD 859.1 million |
| Market revenue in 2033 | USD 1,676.7 million |
| Growth rate | 7.9% (CAGR from 2025 to 2033) |
| Largest segment | Dicing equipment |
| Fastest growing segment | Dicing Equipment |
| Historical data covered | 2021 - 2023 |
| Base year for estimation | 2024 |
| Forecast period covered | 2025 - 2033 |
| Quantitative units | Revenue in USD million |
| Market segmentation | Dicing Equipment |
| Key market players worldwide | Applied Materials Inc, ASMPT Ltd, Veeco Instruments Inc, Besi, Kulicke & Soffa Industries Inc, Lam Research Corp, Nikon Corp, Plasma-Therm, Rudolph Technologies, SCREEN Semiconductor Solutions, SUSS MicroTec, Teradyne Inc, Tokyo Electron Ltd |
Other key industry trends
- In terms of revenue, Europe region accounted for 19.4% of the global semiconductor assembly and packaging equipment market in 2024.
- Globally, Asia Pacific is projected to lead the regional market in terms of revenue in 2033.
- Asia Pacific is the fastest growing regional market and is projected to reach USD 6,483.2 million by 2033.
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Semiconductor Assembly and Packaging Equipment Market Companies
| Name | Profile | # Employees | HQ | Website |
|---|---|---|---|---|
| Besi | View profile | 51-100 | West Chester, Pennsylvania, United States, North America | https://besi-inc.com/ |
| SCREEN Semiconductor Solutions | View profile | 251-500 | Sunnyvale, California, United States, North America | https://www.screen-spe.com/us/ |
| Rudolph Technologies | View profile | 501-1000 | Flanders, New Jersey, United States, North America | http://www.rudolphtech.com |
| SUSS MicroTec | View profile | 501-1000 | Garching, Bayern, Germany, Europe | https://www.suss.com |
| Kulicke & Soffa Industries Inc | View profile | 3025 | 1005 Virginia Drive, Fort Washington, Philadelphia, PA, United States, 19034 | https://www.kns.com |
| ASMPT Ltd | View profile | 10800 | 2 Yishun Avenue 7, Singapore, Singapore, 768924 | https://www.asmpt.com |
| Plasma-Therm | View profile | 51-100 | St. Petersburg, Florida, United States, North America | http://www.plasmatherm.com |
| Veeco Instruments Inc | View profile | 1215 | Terminal Drive, Plainview, NY, United States, 11803 | https://www.veeco.com |
| Tokyo Electron Ltd | View profile | 17204 | Akasaka Biz Tower, 3-1 Akasaka 5-chome, Minato-ku, Tokyo, Japan, 107-6325 | http://www.tel.co.jp |
| Lam Research Corp | View profile | 17200 | 4650 Cushing Parkway, Fremont, CA, United States, 94538 | https://www.lamresearch.com |
| Applied Materials Inc | View profile | 34000 | 3050 Bowers Avenue, P.O. Box 58039, Santa Clara, CA, United States, 95052-8039 | https://www.appliedmaterials.com |
| Nikon Corp | View profile | 19444 | Konan 2-15-3 Shinagawa Intercity Building C, Minato-ku, Tokyo, Japan, 108-6290 | http://www.nikon.co.jp |
| Teradyne Inc | View profile | 6500 | 600 Riverpark Drive, North Reading, MA, United States, 01864 | https://www.teradyne.com |
Europe semiconductor assembly and packaging equipment market outlook
The databook is designed to serve as a comprehensive guide to navigating this sector. The databook focuses on market statistics denoted in the form of revenue and y-o-y growth and CAGR across the globe and regions. A detailed competitive and opportunity analyses related to semiconductor assembly and packaging equipment market will help companies and investors design strategic landscapes.
Dicing equipment was the largest segment with a revenue share of 105.85% in 2024. Horizon Databook has segmented the Europe semiconductor assembly and packaging equipment market based on dicing equipment covering the revenue growth of each sub-segment from 2021 to 2033.
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Target buyers of Europe semiconductor assembly and packaging equipment market databook
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Our clientele includes a mix of semiconductor assembly and packaging equipment market companies, investment firms, advisory firms & academic institutions.
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30% of our revenue is generated working with investment firms and helping them identify viable opportunity areas.
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Approximately 65% of our revenue is generated working with competitive intelligence & market intelligence teams of market participants (manufacturers, service providers, etc.).
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The rest of the revenue is generated working with academic and research not-for-profit institutes. We do our bit of pro-bono by working with these institutions at subsidized rates.
Horizon Databook provides a detailed overview of continent-level data and insights on the Europe semiconductor assembly and packaging equipment market , including forecasts for subscribers. This continent databook contains high-level insights into Europe semiconductor assembly and packaging equipment market from 2021 to 2033, including revenue numbers, major trends, and company profiles.
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