Market revenue in 2023 | USD 456.9 million |
Market revenue in 2030 | USD 566.2 million |
Growth rate | 3.1% (CAGR from 2023 to 2030) |
Largest segment | Mixed signal ics |
Fastest growing segment | Memory |
Historical data | 2017 - 2022 |
Base year | 2023 |
Forecast period | 2024 - 2030 |
Quantitative units | Revenue in USD million |
Market segmentation | Mixed Signal ICs, Processors & Controllers, Memory, Power Management |
Key market players worldwide | Advanced Micro Devices Inc, BAE Systems PLC, Honeywell International Inc, Infineon Technologies AG, Microchip Technology Inc, Renesas Electronics Corp, STMicroelectronics NV, Teledyne Technologies Inc, Texas Instruments Inc, TTM Technologies Inc |
Mixed signal ics was the largest segment with a revenue share of 28.1% in 2023. Horizon Databook has segmented the U.S. radiation hardened electronics market based on mixed signal ics, processors & controllers, memory, power management covering the revenue growth of each sub-segment from 2017 to 2030.
Advancements in materials and design, driven by companies and research institutions such as The National Aeronautics and Space Administration, are pivotal in propelling the Radiation hardened electronics market in the U.S. NASA's exploration of 3D-printing techniques for radiation-shielded electronics enclosures offers tailored solutions for specific spacecraft components, enhancing reliability and performance.
These innovations serve specific applications such as high-performance processors for deep space missions, Radiation hardened sensors for extreme environments, and radiation-tolerant LIDAR systems for precise spacecraft docking. Consequently, these advancements meet the demands of the burgeoning space exploration sector and also drive growth and innovation within the Radiation hardened electronics market in the U.S.
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