Europe Molded Interconnect Device Market Size & Outlook
The molded interconnect device market in Europe is expected to reach a projected revenue of US$ 1,118.1 million by 2030. A compound annual growth rate of 13.3% is expected of Europe molded interconnect device market from 2024 to 2030.
Revenue, 2023 (US$M)
$465.4
Forecast, 2030 (US$M)
$1,118.1
CAGR, 2024 - 2030
13.3%
Report Coverage
Europe
Europe molded interconnect device market highlights
- The Europe molded interconnect device market generated a revenue of USD 465.4 million in 2023.
- The market is expected to grow at a CAGR of 13.3% from 2024 to 2030.
- In terms of segment, laser direct structuring (lds) was the largest revenue generating process in 2023.
- Laser Direct Structuring (LDS) is the most lucrative process segment registering the fastest growth during the forecast period.
Europe data book summary
| Market revenue in 2023 | USD 465.4 million |
| Market revenue in 2030 | USD 1,118.1 million |
| Growth rate | 13.3% (CAGR from 2024 to 2030) |
| Largest segment | Laser direct structuring (lds) |
| Fastest growing segment | Laser Direct Structuring (LDS) |
| Historical data covered | 2018 - 2022 |
| Base year for estimation | 2023 |
| Forecast period covered | 2024 - 2030 |
| Quantitative units | Revenue in USD million |
| Market segmentation | Laser Direct Structuring (LDS) |
| Key market players worldwide | TE Connectivity Ltd, Kyocera Corp, Koch Industries, Amphenol Corp Class A, Sumitomo Corp |
Other key industry trends
- In terms of revenue, Europe region accounted for 24.3% of the global molded interconnect device market in 2023.
- Globally, Asia Pacific is projected to lead the regional market in terms of revenue in 2030.
- Asia Pacific is the fastest growing regional market and is projected to reach USD 1,647.7 million by 2030.
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Molded Interconnect Device Market Scope
Molded interconnect device market segmentation & scope
Product
Sensor Housings
Antennas
Connectors & Switchers
Lighting
Other Product
End Use
Healthcare
Automotive
Consumer Electronics
Telecommunication
Aerospace and Defense
Other End Use
Countries
U.S.
Canada
Mexico
UK
Germany
France
China
Japan
India
South Korea
Australia
Brazil
Saudi Arabia
UAE
South Africa
Molded Interconnect Device Market Companies
| Name | Profile | # Employees | HQ | Website |
|---|---|---|---|---|
| Koch Industries | View profile | 10001+ | Wichita, Kansas, United States, North America | https://www.kochind.com |
| Kyocera Corp | View profile | 81209 | 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto, Japan, 612-8501 | http://www.kyocera.co.jp |
| TE Connectivity Ltd | View profile | 90000 | Muhlenstrasse 26, Schaffhausen, Switzerland, CH-8200 | https://www.te.com |
| Amphenol Corp Class A | View profile | 95000 | 358 Hall Avenue, Wallingford, CT, United States, 06492 | https://www.amphenol.com |
| Sumitomo Corp | View profile | 108457 | 3-2 Otemachi 2-Chome, Chiyoda-ku, Tokyo, Japan, 100-8601 | http://www.sumitomocorp.co.jp |
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