Asia Pacific Molded Interconnect Device Market Size & Outlook

The molded interconnect device market in Asia Pacific is expected to reach a projected revenue of US$ 1,647.7 million by 2030. A compound annual growth rate of 13.8% is expected of Asia Pacific molded interconnect device market from 2024 to 2030.
Revenue, 2023 (US$M)
$664.6
Forecast, 2030 (US$M)
$1,647.7
CAGR, 2024 - 2030
13.8%
Report Coverage
Asia Pacific

Asia Pacific molded interconnect device market, 2018-2030 (US$M)

Asia
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Asia Pacific molded interconnect device market highlights

  • The Asia Pacific molded interconnect device market generated a revenue of USD 664.6 million in 2023.
  • The market is expected to grow at a CAGR of 13.8% from 2024 to 2030.
  • In terms of segment, laser direct structuring (lds) was the largest revenue generating process in 2023.
  • Laser Direct Structuring (LDS) is the most lucrative process segment registering the fastest growth during the forecast period.


Asia Pacific data book summary

Market revenue in 2023USD 664.6 million
Market revenue in 2030USD 1,647.7 million
Growth rate13.8% (CAGR from 2023 to 2030)
Largest segmentLaser direct structuring (lds)
Fastest growing segmentLaser Direct Structuring (LDS)
Historical data covered2018 - 2022
Base year for estimation2023
Forecast period covered2024 - 2030
Quantitative unitsRevenue in USD million
Market segmentationLaser Direct Structuring (LDS)
Key market players worldwideTE Connectivity Ltd, Kyocera Corp, Koch Industries, Amphenol Corp Class A, Sumitomo Corp


Other key industry trends

  • In terms of revenue, Asia Pacific region accounted for 34.8% of the global molded interconnect device market in 2023.
  • Globally, Asia Pacific is projected to lead the regional market in terms of revenue in 2030.
  • Asia Pacific is the fastest growing regional market and is projected to reach USD 1,647.7 million by 2030.

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Molded Interconnect Device Market Scope

Molded interconnect device market segmentation & scope
Two-Shot Molding
Other Process
Product
Sensor Housings
Antennas
Connectors & Switchers
Lighting
Other Product
End Use
Healthcare
Automotive
Consumer Electronics
Telecommunication
Aerospace and Defense
Other End Use
Countries
U.S.
Canada
Mexico
UK
Germany
France
China
Japan
India
South Korea
Australia
Brazil
Saudi Arabia
UAE
South Africa

Molded Interconnect Device Market Companies

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Asia Pacific molded interconnect device market

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