Europe Advanced Packaging Market Size & Outlook, 2025-2030
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Europe advanced packaging market highlights
- The Europe advanced packaging market generated a revenue of USD 9,193.9 million in 2024.
- The market is expected to grow at a CAGR of 5.5% from 2025 to 2030.
- In terms of segment, flip-chip was the largest revenue generating packaging type in 2024.
- Embedded-Die is the most lucrative packaging type segment registering the fastest growth during the forecast period.
- Country-wise, Germany is expected to register the highest CAGR from 2025 to 2030.
Europe data book summary
| Market revenue in 2024 | USD 9,193.9 million |
| Market revenue in 2030 | USD 12,618.3 million |
| Growth rate | 5.5% (CAGR from 2025 to 2030) |
| Largest segment | Flip-chip |
| Fastest growing segment | Embedded-Die |
| Historical data covered | 2018 - 2023 |
| Base year for estimation | 2024 |
| Forecast period covered | 2025 - 2030 |
| Quantitative units | Revenue in USD million |
| Market segmentation | Flip-Chip, Fan-Out WLP, Embedded-Die, Fan-In WLP, 2.5D/3D |
| Key market players worldwide | Amkor Technology Inc, ASE Technology Holding Co Ltd ADR, Taiwan Semiconductor Manufacturing Co Ltd, Intel Corp, Samsung Electronics Co Ltd, JCET Group, ASMPT, IPC Systems, Semios, Yole Global, Prodrive Technologies |
Other key industry trends
- In terms of revenue, Europe region accounted for 23.2% of the global advanced packaging market in 2024.
- Globally, Asia Pacific is projected to lead the regional market in terms of revenue in 2030.
- Asia Pacific is the fastest growing regional market and is projected to reach USD 24,524.9 million by 2030.
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Advanced Packaging Market Scope
Advanced Packaging Market Companies
| Name | Profile | # Employees | HQ | Website |
|---|---|---|---|---|
| Yole Global | View profile | 51-100 | Singapore, Central Region, Singapore, Asia | https://www.yole.com |
| IPC Systems | View profile | 1001-5000 | Alpharetta, Georgia, United States, North America | http://www.ipc.com |
| JCET Group | View profile | 10001+ | Jiangyin, Jiangsu, China, Asia | https://jcetglobal.com |
| ASMPT | View profile | 10001+ | Singapore, Central Region, Singapore, Asia | http://www.asmpt.com |
| Prodrive Technologies | View profile | 1001-5000 | Son, Noord-Brabant, The Netherlands, Europe | https://prodrive-technologies.com/ |
| Semios | View profile | 101-250 | Vancouver, British Columbia, Canada, North America | http://semios.com |
| ASE Technology Holding Co Ltd ADR | View profile | 91568 | No. 26, Chin Third Road, Nanzih District, Kaohsiung, Taiwan, 811 | https://www.aseglobal.com |
| Amkor Technology Inc | View profile | 28700 | 2045 East Innovation Circle, Tempe, AZ, United States, 85284 | https://www.amkor.com |
| Taiwan Semiconductor Manufacturing Co Ltd | View profile | 76478 | No. 8, Li-Hsin Road 6, Hsinchu Science Park, Hsinchu, Taiwan, 300-096 | https://www.tsmc.com |
| Samsung Electronics Co Ltd | View profile | 124804 | 129, Samsung-ro, Yeongtong-gu, Gyeonggi-do, Suwon-si, Korea, Republic of, 443-742 | https://www.samsung.com |
| Intel Corp | View profile | 124800 | 2200 Mission College Boulevard, Santa Clara, CA, United States, 95054-1549 | https://www.intel.com |
Europe advanced packaging market outlook
The databook is designed to serve as a comprehensive guide to navigating this sector. The databook focuses on market statistics denoted in the form of revenue and y-o-y growth and CAGR across the globe and regions. A detailed competitive and opportunity analyses related to advanced packaging market will help companies and investors design strategic landscapes.
Flip-chip was the largest segment with a revenue share of 40.69% in 2024. Horizon Databook has segmented the Europe advanced packaging market based on flip-chip, fan-out wlp, embedded-die, fan-in wlp, 2.5d/3d covering the revenue growth of each sub-segment from 2018 to 2030.
The region has established itself as a center for automotive and industrial electronics innovation, with companies such as Infineon, STMicroelectronics, and NXP Semiconductors heavily investing in advanced packaging technologies.
These companies are developing sophisticated packaging solutions for automotive applications such as advanced driver-assistance systems (ADAS), electric vehicle power modules, and autonomous driving capabilities, which demand higher performance, reliability, and miniaturization than conventional packaging can provide.
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Our clientele includes a mix of advanced packaging market companies, investment firms, advisory firms & academic institutions.
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Approximately 65% of our revenue is generated working with competitive intelligence & market intelligence teams of market participants (manufacturers, service providers, etc.).
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Horizon Databook provides a detailed overview of continent-level data and insights on the Europe advanced packaging market , including forecasts for subscribers. This continent databook contains high-level insights into Europe advanced packaging market from 2018 to 2030, including revenue numbers, major trends, and company profiles.
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Europe advanced packaging market size, by country, 2018-2030 (US$M)
Europe Advanced Packaging Market Outlook Share, 2024 & 2030 (US$M)
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