China Advanced Packaging Market Size & Outlook, 2025-2030
Related Markets
China advanced packaging market highlights
- The China advanced packaging market generated a revenue of USD 3,323.7 million in 2024 and is expected to reach USD 4,828.9 million by 2030.
- The China market is expected to grow at a CAGR of 6.5% from 2025 to 2030.
- In terms of segment, flip-chip was the largest revenue generating packaging type in 2024.
- Embedded-Die is the most lucrative packaging type segment registering the fastest growth during the forecast period.
Advanced packaging market data book summary
| Market revenue in 2024 | USD 3,323.7 million |
| Market revenue in 2030 | USD 4,828.9 million |
| Growth rate | 6.5% (CAGR from 2025 to 2030) |
| Largest segment | Flip-chip |
| Fastest growing segment | Embedded-Die |
| Historical data | 2018 - 2023 |
| Base year | 2024 |
| Forecast period | 2025 - 2030 |
| Quantitative units | Revenue in USD million |
| Market segmentation | Flip-Chip, Fan-Out WLP, Embedded-Die, Fan-In WLP, 2.5D/3D |
| Key market players worldwide | Amkor Technology Inc, ASE Technology Holding Co Ltd ADR, Taiwan Semiconductor Manufacturing Co Ltd, Intel Corp, Samsung Electronics Co Ltd, JCET Group, ASMPT, IPC Systems, Semios, Yole Global, Prodrive Technologies |
Other key industry trends
- In terms of revenue, China accounted for 8.4% of the global advanced packaging market in 2024.
- Country-wise, U.S. is expected to lead the global market in terms of revenue in 2030.
- In Asia Pacific, China advanced packaging market is projected to lead the regional market in terms of revenue in 2030.
- China is the fastest growing regional market in Asia Pacific and is projected to reach USD 4,828.9 million by 2030.
No credit card required*
Horizon in a snapshot
- 30K+ Global Market Reports
- 120K+ Country Reports
- 1.2M+ Market Statistics
- 200K+ Company Profiles
- Industry insights and more
Advanced Packaging Market Scope
Advanced Packaging Market Companies
| Name | Profile | # Employees | HQ | Website |
|---|---|---|---|---|
| Yole Global | View profile | 51-100 | Singapore, Central Region, Singapore, Asia | https://www.yole.com |
| IPC Systems | View profile | 1001-5000 | Alpharetta, Georgia, United States, North America | http://www.ipc.com |
| JCET Group | View profile | 10001+ | Jiangyin, Jiangsu, China, Asia | https://jcetglobal.com |
| ASMPT | View profile | 10001+ | Singapore, Central Region, Singapore, Asia | http://www.asmpt.com |
| Prodrive Technologies | View profile | 1001-5000 | Son, Noord-Brabant, The Netherlands, Europe | https://prodrive-technologies.com/ |
| Semios | View profile | 101-250 | Vancouver, British Columbia, Canada, North America | http://semios.com |
| ASE Technology Holding Co Ltd ADR | View profile | 91568 | No. 26, Chin Third Road, Nanzih District, Kaohsiung, Taiwan, 811 | https://www.aseglobal.com |
| Amkor Technology Inc | View profile | 28700 | 2045 East Innovation Circle, Tempe, AZ, United States, 85284 | https://www.amkor.com |
| Taiwan Semiconductor Manufacturing Co Ltd | View profile | 76478 | No. 8, Li-Hsin Road 6, Hsinchu Science Park, Hsinchu, Taiwan, 300-096 | https://www.tsmc.com |
| Samsung Electronics Co Ltd | View profile | 124804 | 129, Samsung-ro, Yeongtong-gu, Gyeonggi-do, Suwon-si, Korea, Republic of, 443-742 | https://www.samsung.com |
| Intel Corp | View profile | 124800 | 2200 Mission College Boulevard, Santa Clara, CA, United States, 95054-1549 | https://www.intel.com |
China advanced packaging market outlook
The databook is designed to serve as a comprehensive guide to navigating this sector. The databook focuses on market statistics denoted in the form of revenue and y-o-y growth and CAGR across the globe and regions. A detailed competitive and opportunity analyses related to advanced packaging market will help companies and investors design strategic landscapes.
Flip-chip was the largest segment with a revenue share of 41.08% in 2024. Horizon Databook has segmented the China advanced packaging market based on flip-chip, fan-out wlp, embedded-die, fan-in wlp, 2.5d/3d covering the revenue growth of each sub-segment from 2018 to 2030.
China's advanced packaging market growth can be attributed to its substantial investments in semiconductor infrastructure and manufacturing capabilities. The Chinese government has committed hundreds of billions of dollars through initiatives such as the "Made in China 2025" program and the National Integrated Circuit Industry Investment Fund, specifically targeting advanced packaging technologies as a strategic priority to reduce dependence on foreign chip suppliers while building domestic expertise.
Reasons to subscribe to China advanced packaging market databook:
-
Access to comprehensive data: Horizon Databook provides over 1 million market statistics and 20,000+ reports, offering extensive coverage across various industries and regions.
-
Informed decision making: Subscribers gain insights into market trends, customer preferences, and competitor strategies, empowering informed business decisions.
-
Cost-Effective solution: It's recognized as the world's most cost-effective market research database, offering high ROI through its vast repository of data and reports.
-
Customizable reports: Tailored reports and analytics allow companies to drill down into specific markets, demographics, or product segments, adapting to unique business needs.
-
Strategic advantage: By staying updated with the latest market intelligence, companies can stay ahead of competitors, anticipate industry shifts, and capitalize on emerging opportunities.
Target buyers of China advanced packaging market databook
-
Our clientele includes a mix of advanced packaging market companies, investment firms, advisory firms & academic institutions.
-
30% of our revenue is generated working with investment firms and helping them identify viable opportunity areas.
-
Approximately 65% of our revenue is generated working with competitive intelligence & market intelligence teams of market participants (manufacturers, service providers, etc.).
-
The rest of the revenue is generated working with academic and research not-for-profit institutes. We do our bit of pro-bono by working with these institutions at subsidized rates.
Horizon Databook provides a detailed overview of country-level data and insights on the China advanced packaging market , including forecasts for subscribers. This country databook contains high-level insights into China advanced packaging market from 2018 to 2030, including revenue numbers, major trends, and company profiles.
Partial client list
China Packaging Type - Advanced Packaging Market, 2024 - 2030 (US$M)
China Advanced Packaging Market Outlook Share, 2024 & 2030 (US$M)
Related statistics
Sign up - it's easy, and free!
Sign up and get instant basic access to databook, upgrade
when ready, or enjoy our
free plan indefinitely.
Included in Horizon account
- 30K+ Global Market Reports
- 120K+ Country Reports
- 1.2M+ Market Statistics
- 200K+ Company Profiles
- Industry insights and more
